- Multi-station Lapping & Polishing System
LP70 은 multi-station precision lapping and polishing system 으로, 4개의 workstations 을 이용한 동시 자동 가공이 가능합니다.
* Four workstations each with a wafer process capacity of up to 100mm/4″
* Bluetooth enabled features such as automatic plate flatness control and real time data collection and feedback from digital indicator on jigs for end point thickness control and increased accuracy
* Metered abrasive feed delivery via peristaltic pumps allowing users to set the flow rate between 1-100ml
* Driven jig roller arm technology greatly increases accuracy and repeatability
* Plate speeds of between 5 and 100rpm, facilitating faster lapping and polishing rates